ML Methodology: Taxonomy for Within-Wafer Variation Prediction
the far side of the Moon This report presents a structured taxonomy of machine learning methodologies specialized for Within-Wafer (WIW) variation prediction in semiconductor manufacturing. General-purpose ML approaches often fail to exploit the unique spatial structure of wafer data: circular geometry, process-induced radial symmetry, and strong inter-site correlations. The seven categories below organize WIW-specific methods…
